English
Spain
Rusia
China
Germany02-1508-20
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
02-1508-20
DESCRIZIONE
CONN IC DIP SOCKET 2POS GOLD
DESCRIZIONE DETTAGLIATA
2 (1 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
5 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
508
Package
Bulk
Product Status
Active
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
2 (1 x 2)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Wire Wrap
Pitch - Post
-
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.360" (9.14mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
02-1508
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 02-1508-20
Documenti e supporti
Datasheets
1(508 Series Sgl/Dual Wire Wrap)
Environmental Information
()
HTML Datasheet
1(508 Series Sgl/Dual Wire Wrap)
Quantità Prezzo
QUANTITÀ: 556
Prezzo unitario: $0.81809
Imballaggio: Bulk
Moltiplicatore minimo: 556
Imballaggio: Bulk
Moltiplicatore minimo: 556
Sostituti
-