Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Clip, Thermal Material
Shape
Rectangular, Pin Fins
Fin Height
0.500" (12.70mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
2.50°C/W @ 250 LFM
Thermal Resistance @ Natural
-
Material Finish
Black Anodized
Base Product Number
609-50