Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
ICF-632-S-O
DESCRIZIONE
CONN IC DIP SOCKET 32POS TIN
DESCRIZIONE DETTAGLIATA
32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount
PRODUTTORE
Samtec Inc.
INIZIATIVA STANDARD
6 Weeks
MODELLO EDACAD
ICF-632-S-O Models
PACCHETTO STANDARD

Specifiche tecniche

Mfr
Samtec Inc.
Series
ICF
Package
Tube
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
32 (2 x 16)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Beryllium Copper
Housing Material
Liquid Crystal Polymer (LCP)
Operating Temperature
-55°C ~ 125°C
Termination Post Length
-
Material Flammability Rating
-
Contact Resistance
-
Base Product Number
ICF-632

Classificazioni ambientali e di esportazione

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65

Altri nomi

-

Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Samtec Inc. ICF-632-S-O

Documenti e supporti

CAD Models
1(ICF-632-S-O Models)
HTML Datasheet
1(ICF-yyy-yyy-y-yy Drawing)
Product Drawings
1(ICF-yyy-yyy-y-yy Drawing)

Quantità Prezzo

QUANTITÀ: 14
Prezzo unitario: $9.86714
Imballaggio: Tube
Moltiplicatore minimo: 14

Sostituti

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