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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
520-AG12D-ES
DESCRIZIONE
CONN IC DIP SOCKET 20POS TINLEAD
DESCRIZIONE DETTAGLIATA
20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
3,840
STOCK FORNITORI
Specifiche tecniche
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
20 (2 x 10)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin-Lead
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
-
Contact Finish Thickness - Post
-
Contact Material - Post
Brass
Housing Material
-
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
-
Contact Resistance
10mOhm
Base Product Number
520
Classificazioni ambientali e di esportazione
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
3-1437536-1
3-1437536-1-ND
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 520-AG12D-ES
Documenti e supporti
Datasheets
1(500 Series)
Quantità Prezzo
-
Sostituti
-