English
Spain
Rusia
China
Germany528-AG12D-LF
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
528-AG12D-LF
DESCRIZIONE
CONN IC DIP SOCKET 28POS TIN
DESCRIZIONE DETTAGLIATA
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
425
STOCK FORNITORI
Specifiche tecniche
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Beryllium Copper
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
528
Classificazioni ambientali e di esportazione
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
1571550-9
1571550-9-ND
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 528-AG12D-LF
Documenti e supporti
Datasheets
1(1571550)
Environmental Information
1(1571550-9 Statement of Compliance)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(1571550)
3D Drawings
1(1571550-9.pdf)
Quantità Prezzo
-
Sostituti
-