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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
808-AG12D
DESCRIZIONE
CONN IC DIP SOCKET 8POS TIN-LEAD
DESCRIZIONE DETTAGLIATA
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
9,600
STOCK FORNITORI
Specifiche tecniche
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin-Lead
Contact Finish Thickness - Mating
-
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
-
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
808
Classificazioni ambientali e di esportazione
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-808-AG12D-SI
A109231
1-1437537-2
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 808-AG12D
Documenti e supporti
PCN Obsolescence/ EOL
1(808-AG12D 19/Oct/2014)
Product Drawings
1(800 Series Drawing)
Quantità Prezzo
-
Sostituti
-