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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
HIC-764-SST
DESCRIZIONE
CONN IC DIP SOCKET 64POS GOLD
DESCRIZIONE DETTAGLIATA
64 (2 x 32) Pos DIP, 0.75" (19.05mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
Samtec Inc.
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Samtec Inc.
Series
HIC
Package
Tube
Product Status
Obsolete
Type
DIP, 0.75" (19.05mm) Row Spacing
Number of Positions or Pins (Grid)
64 (2 x 32)
Pitch - Mating
0.070" (1.78mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.070" (1.78mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyester, Glass Filled
Operating Temperature
-
Termination Post Length
0.118" (3.00mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
-
Base Product Number
HIC-764
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Samtec Inc. HIC-764-SST
Documenti e supporti
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(HIC-764-SST Drawing)
Product Drawings
1(HIC-764-SST Drawing)
Quantità Prezzo
-
Sostituti
-