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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
24-3551-18
DESCRIZIONE
CONN IC DIP SOCKET ZIF 24POS
DESCRIZIONE DETTAGLIATA
24 (2 x 12) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
6 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
55
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
24 (2 x 12)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0µin (1.27µm)
Contact Material - Mating
Beryllium Nickel
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0µin (1.27µm)
Contact Material - Post
Beryllium Nickel
Housing Material
Polyetheretherketone (PEEK), Glass Filled
Operating Temperature
-55°C ~ 250°C
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
24-3551
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 24-3551-18
Documenti e supporti
Environmental Information
()
Quantità Prezzo
QUANTITÀ: 10
Prezzo unitario: $93.969
Imballaggio: Bulk
Moltiplicatore minimo: 10
Imballaggio: Bulk
Moltiplicatore minimo: 10
Sostituti
-