Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
44-3573-16
DESCRIZIONE
CONN IC DIP SOCKET ZIF 44POS
DESCRIZIONE DETTAGLIATA
44 (2 x 22) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
5 Weeks
MODELLO EDACAD
PACCHETTO STANDARD

Specifiche tecniche

Mfr
Aries Electronics
Series
57
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
44 (2 x 22)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0µin (1.27µm)
Contact Material - Mating
Beryllium Nickel
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0µin (1.27µm)
Contact Material - Post
Beryllium Nickel
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
44-3573

Classificazioni ambientali e di esportazione

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Altri nomi

-

Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 44-3573-16

Documenti e supporti

Datasheets
1(57 Series)
Environmental Information
()
HTML Datasheet
1(57 Series)

Quantità Prezzo

QUANTITÀ: 12
Prezzo unitario: $53.80667
Imballaggio: Bulk
Moltiplicatore minimo: 12

Sostituti

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