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Germany336-PLS20019-12
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
336-PLS20019-12
DESCRIZIONE
CONN SOCKET PGA ZIF GOLD
DESCRIZIONE DETTAGLIATA
Pos PGA, ZIF (ZIP) Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
5 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
PLS
Package
Bulk
Product Status
Active
Type
PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)
-
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS)
Operating Temperature
-65°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
336-PLS
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 336-PLS20019-12
Documenti e supporti
Datasheets
1(ZIF PGA)
Environmental Information
()
Quantità Prezzo
QUANTITÀ: 3
Prezzo unitario: $146.56333
Imballaggio: Bulk
Moltiplicatore minimo: 3
Imballaggio: Bulk
Moltiplicatore minimo: 3
Sostituti
-