Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
IC-316-SGG
DESCRIZIONE
CONN IC DIP SOCKET 16POS GOLD
DESCRIZIONE DETTAGLIATA
16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
Samtec Inc.
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD

Specifiche tecniche

Mfr
Samtec Inc.
Series
IC
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
16 (2 x 8)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyester, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
IC-316

Classificazioni ambientali e di esportazione

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Altri nomi

-

Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Samtec Inc. IC-316-SGG

Documenti e supporti

Datasheets
1(IC Series)
HTML Datasheet
()
Product Drawings
()

Quantità Prezzo

-

Sostituti

Parte n. : 110-13-316-41-001000
Produttore. : Mill-Max Manufacturing Corp.
Quantità disponibile. : 5,887
Prezzo unitario. : $2.87000
Tipo sostitutivo. : Direct