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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
40-1518-11H
DESCRIZIONE
CONN IC DIP SOCKET 40POS GOLD
DESCRIZIONE DETTAGLIATA
40 (2 x 20) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
5 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
518
Package
Bulk
Product Status
Active
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
40 (2 x 20)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
40-1518
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 40-1518-11H
Documenti e supporti
Datasheets
1(518 Series Sgl/Dual Solder Pin)
Environmental Information
()
HTML Datasheet
1(518 Series Sgl/Dual Solder Pin)
Quantità Prezzo
QUANTITÀ: 50
Prezzo unitario: $9.1808
Imballaggio: Bulk
Moltiplicatore minimo: 50
Imballaggio: Bulk
Moltiplicatore minimo: 50
Sostituti
-