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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
NC191LT50T5
DESCRIZIONE
SMOOTH FLOW LOW TEMP SOLDER PAST
DESCRIZIONE DETTAGLIATA
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
PRODUTTORE
Chip Quik Inc.
INIZIATIVA STANDARD
4 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
1
STOCK FORNITORI
Specifiche tecniche
Mfr
Chip Quik Inc.
Series
Smooth Flow™
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
280°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
5
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
NC191
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Altri nomi
-
Categoria
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. NC191LT50T5
Documenti e supporti
Datasheets
1(NC191LT50T5 Datasheet)
MSDS Material Safety Datasheet
1(NC191LT50T5 SDS)
HTML Datasheet
1(NC191LT50T5 Datasheet)
Quantità Prezzo
QUANTITÀ: 1
Prezzo unitario: $27.95
Imballaggio: Bulk
Moltiplicatore minimo: 1
Imballaggio: Bulk
Moltiplicatore minimo: 1
Sostituti
-