Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
816-AG11D-ES
DESCRIZIONE
CONN IC DIP SOCKET 16POS GOLD
DESCRIZIONE DETTAGLIATA
16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
30

Specifiche tecniche

Mfr
TE Connectivity AMP Connectors
Series
800
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
16 (2 x 8)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
80.0µin (2.03µm)
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
816

Classificazioni ambientali e di esportazione

RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040

Altri nomi

2-1437539-8
A126553
2266-816-AG11D-ES

Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 816-AG11D-ES

Documenti e supporti

Datasheets
1(Dip Sockets Reference Guide)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(Dip Sockets Reference Guide)
Product Drawings
1(1437539-2 Drawing)

Quantità Prezzo

-

Sostituti

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