Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
605-93-650-11-480000
DESCRIZIONE
CONN IC DIP SOCKET 50POS GOLD
DESCRIZIONE DETTAGLIATA
50 (2 x 25) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
Mill-Max Manufacturing Corp.
INIZIATIVA STANDARD
2 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
8

Specifiche tecniche

Mfr
Mill-Max Manufacturing Corp.
Series
605
Package
Tube
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
50 (2 x 25)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Carrier, Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass Alloy
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.124" (3.15mm)
Material Flammability Rating
-
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
605-93

Classificazioni ambientali e di esportazione

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Altri nomi

60593-65011480000
6059365011480000

Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Mill-Max Manufacturing Corp. 605-93-650-11-480000

Documenti e supporti

Datasheets
1(605,614 Series (in.))
Environmental Information
1(RoHS Cert)

Quantità Prezzo

QUANTITÀ: 56
Prezzo unitario: $19.36464
Imballaggio: Tube
Moltiplicatore minimo: 56

Sostituti

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