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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
520-AG11D-ES
DESCRIZIONE
DIP SOCKET T/H 20POS
DESCRIZIONE DETTAGLIATA
20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
24
STOCK FORNITORI
Specifiche tecniche
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
20 (2 x 10)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
-
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
-
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
520
Classificazioni ambientali e di esportazione
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
A126551
Q5396740QT
2-1437536-6
520-AG11D-ES-ND
2266-520-AG11D-ES
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 520-AG11D-ES
Documenti e supporti
Datasheets
()
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
()
Quantità Prezzo
-
Sostituti
-