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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
608-CG1T
DESCRIZIONE
CONN IC DIP SOCKET 8POS GOLD
DESCRIZIONE DETTAGLIATA
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
150
STOCK FORNITORI
Specifiche tecniche
Mfr
TE Connectivity AMP Connectors
Series
600
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
-
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
-
Contact Material - Post
Phosphor Bronze
Housing Material
Thermoplastic, Polyester
Operating Temperature
-65°C ~ 125°C
Termination Post Length
0.158" (4.01mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
5 A
Contact Resistance
-
Base Product Number
608
Classificazioni ambientali e di esportazione
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
1-1437515-3
A130916
608-CG1T-ND
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 608-CG1T
Documenti e supporti
Datasheets
1(600 Series Datasheet)
PCN Obsolescence/ EOL
()
Quantità Prezzo
-
Sostituti
-