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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
1-1437542-1
DESCRIZIONE
CONN IC DIP SOCKET 8POS GOLD
DESCRIZIONE DETTAGLIATA
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
PRODUTTORE
TE Connectivity AMP Connectors
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
TE Connectivity AMP Connectors
Series
700
Package
-
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
20.0µin (0.51µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Carrier, Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
20.0µin (0.51µm)
Contact Material - Post
Beryllium Copper
Housing Material
Aluminum Alloy
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Classificazioni ambientali e di esportazione
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 1-1437542-1
Documenti e supporti
Datasheets
1(1437542)
HTML Datasheet
1(1437542)
Quantità Prezzo
-
Sostituti
-