Mfr
Laird Technologies - Thermal Materials
Type
Gap Filler Pad, Sheet
Outline
229.00mm x 229.00mm
Thickness
0.0790" (2.000mm)
Material
Non-Silicone, Ceramic Filled
Thermal Conductivity
10.2W/m-K
Shelf Life Start
Date of Shipment
Storage/Refrigeration Temperature
-
allaboutcomponents.com Storage
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