English
Spain
Rusia
China
Germany133-PGM14013-10
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
133-PGM14013-10
DESCRIZIONE
CONN SOCKET PGA GOLD
DESCRIZIONE DETTAGLIATA
Pos PGA Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
6 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
PGM
Package
Bulk
Product Status
Active
Type
PGA
Number of Positions or Pins (Grid)
-
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.165" (4.19mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
133-PGM
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 133-PGM14013-10
Documenti e supporti
Datasheets
1(Pin Grid Array Socket/Header)
Environmental Information
()
HTML Datasheet
1(Pin Grid Array Socket/Header)
Quantità Prezzo
QUANTITÀ: 24
Prezzo unitario: $17.49083
Imballaggio: Bulk
Moltiplicatore minimo: 24
Imballaggio: Bulk
Moltiplicatore minimo: 24
Sostituti
-