English
Spain
Rusia
China
Germany200-6325-9UN-1900
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
200-6325-9UN-1900
DESCRIZIONE
CONN SOCKET PGA ZIF 625POS GOLD
DESCRIZIONE DETTAGLIATA
625 (25 x 25) Pos PGA, ZIF (ZIP) Socket Gold Through Hole
PRODUTTORE
3M
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
10
STOCK FORNITORI
Specifiche tecniche
Mfr
3M
Series
Textool™
Package
Bulk
Product Status
Obsolete
Type
PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)
625 (25 x 25)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyethersulfone (PES)
Operating Temperature
-55°C ~ 150°C
Termination Post Length
0.130" (3.30mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
200
Classificazioni ambientali e di esportazione
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
5113869644
7100006114
JE150901377
20063259UN1900
51138696443
0 51138 69644 3
3M5073
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/3M 200-6325-9UN-1900
Documenti e supporti
Datasheets
1(Test & Burn-In PGA Kit Sockets)
Video File
1(Textool Sockets)
Design Resources
1(SOIC Socket Pin Sequence)
PCN Obsolescence/ EOL
()
HTML Datasheet
()
Quantità Prezzo
-
Sostituti
-