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Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
30-0508-31
DESCRIZIONE
CONN SOCKET SIP 30POS GOLD
DESCRIZIONE DETTAGLIATA
30 (1 x 30) Pos SIP Socket Gold Through Hole
PRODUTTORE
Aries Electronics
INIZIATIVA STANDARD
5 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Aries Electronics
Series
508
Package
Bulk
Product Status
Active
Type
SIP
Number of Positions or Pins (Grid)
30 (1 x 30)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Wire Wrap
Pitch - Post
-
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.500" (12.70mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
30-0508
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Altri nomi
-
Categoria
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 30-0508-31
Documenti e supporti
Datasheets
1(508 Series Sgl/Dual Wire Wrap)
Environmental Information
()
HTML Datasheet
1(508 Series Sgl/Dual Wire Wrap)
Quantità Prezzo
QUANTITÀ: 22
Prezzo unitario: $19.30727
Imballaggio: Bulk
Moltiplicatore minimo: 22
Imballaggio: Bulk
Moltiplicatore minimo: 22
Sostituti
-