English
Spain
Rusia
China
GermanySMDLTLFP50T3
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
SMDLTLFP50T3
DESCRIZIONE
SLDR PASTE NO-CLN SN42/BI58 50G
DESCRIZIONE DETTAGLIATA
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
PRODUTTORE
Chip Quik Inc.
INIZIATIVA STANDARD
3 Weeks
MODELLO EDACAD
PACCHETTO STANDARD
STOCK FORNITORI
Specifiche tecniche
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight
0.113 lb (51.26 g)
Base Product Number
SMDLTL
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Altri nomi
-
Categoria
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMDLTLFP50T3
Documenti e supporti
Datasheets
1(SMDLTLFP50T3 Datasheet)
MSDS Material Safety Datasheet
1(SMDLTLFP Series SDS)
Featured Product
1(Solder Paste in 50g Jars)
HTML Datasheet
1(SMDLTLFP50T3 Datasheet)
Quantità Prezzo
QUANTITÀ: 1
Prezzo unitario: $21.04
Imballaggio: Jar
Moltiplicatore minimo: 1
Imballaggio: Jar
Moltiplicatore minimo: 1
Sostituti
-