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GermanySIGC15T60EX1SA1
Panoramica del numero di parte
NUMERO DI PARTE DEL PRODUTTORE
SIGC15T60EX1SA1
DESCRIZIONE
IGBT 3 CHIP 600V 30A WAFER
DESCRIZIONE DETTAGLIATA
IGBT Trench Field Stop 600 V 30 A Surface Mount Die
PRODUTTORE
Infineon Technologies
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
1
STOCK FORNITORI
Specifiche tecniche
Mfr
Infineon Technologies
Series
TrenchStop™
Package
Bulk
Product Status
Active
IGBT Type
Trench Field Stop
Voltage - Collector Emitter Breakdown (Max)
600 V
Current - Collector (Ic) (Max)
30 A
Current - Collector Pulsed (Icm)
90 A
Vce(on) (Max) @ Vge, Ic
1.9V @ 15V, 30A
Switching Energy
-
Input Type
Standard
Td (on/off) @ 25°C
-
Test Condition
-
Operating Temperature
-40°C ~ 175°C (TJ)
Mounting Type
Surface Mount
Package / Case
Die
Supplier Device Package
Die
Base Product Number
SIGC15
Classificazioni ambientali e di esportazione
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
HTSUS
8541.29.0095
Altri nomi
448-SIGC15T60EX1SA1
SP000898836
Categoria
/Product Index/Discrete Semiconductor Products/Transistors/IGBTs/Single IGBTs/Infineon Technologies SIGC15T60EX1SA1
Documenti e supporti
Datasheets
1(SIGC15T60E)
Environmental Information
1(RoHS Certificate)
HTML Datasheet
1(SIGC15T60E)
Quantità Prezzo
-
Sostituti
-