Panoramica del numero di parte

NUMERO DI PARTE DEL PRODUTTORE
BU280Z-178-HT
DESCRIZIONE
CONN IC DIP SOCKET 28POS GOLD
DESCRIZIONE DETTAGLIATA
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount
PRODUTTORE
On Shore Technology Inc.
INIZIATIVA STANDARD
MODELLO EDACAD
PACCHETTO STANDARD
14

Specifiche tecniche

Mfr
On Shore Technology Inc.
Series
BU-178HT
Package
Tube
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
78.7µin (2.00µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Copper
Contact Finish Thickness - Post
Flash
Contact Material - Post
Brass
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.059" (1.50mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
7mOhm
Base Product Number
BU280Z

Classificazioni ambientali e di esportazione

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Altri nomi

BU280Z178HT
ED2209-NDR
ED2209

Categoria

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/On Shore Technology Inc. BU280Z-178-HT

Documenti e supporti

Datasheets
1(BUxx0Z-178HT Datasheet)
Environmental Information
1(OnShore RoHS/REACH)
HTML Datasheet
()
Product Drawings
1(BU-xx0Z-178HT Drawing)

Quantità Prezzo

QUANTITÀ: 56
Prezzo unitario: $2.89375
Imballaggio: Tube
Moltiplicatore minimo: 56

Sostituti

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