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Resumen del número de pieza
Número de pieza del fabricante
818-AG10D
Explicación
CONN IC DIP SOCKET 18POS GOLD
Descripción detallada
18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Fabricación
TE Connectivity AMP Connectors
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
4,160
Inventario de proveedores
Atributos del producto
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
18 (2 x 9)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
-
Contact Finish Thickness - Post
-
Contact Material - Post
-
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
818
Clasificaciones medioambientales y de exportación
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
5-1437537-6
5-1437537-6-ND
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 818-AG10D
Documentos y medios de comunicación
Environmental Information
1(5-1437537-6 Statement of Compliance)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
3D Drawings
1(5-1437537-6.pdf)
Product Drawings
1(800 Series Drawing)
Cantidad y precio
-
Alternativas
-