English
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Italy
Germany24-81250-310C
Resumen del número de pieza
Número de pieza del fabricante
24-81250-310C
Explicación
CONN IC DIP SOCKET 24POS GOLD
Descripción detallada
24 (2 x 12) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Fabricación
Aries Electronics
Plazo de entrega estándar
6 Weeks
Modelo edacad
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Aries Electronics
Series
8
Package
Bulk
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
24 (2 x 12)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame, Elevated
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.140" (3.56mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
24-8125
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
-
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 24-81250-310C
Documentos y medios de comunicación
Datasheets
1(8 Series Elevator Skt .300/.600)
Environmental Information
()
HTML Datasheet
1(8 Series Elevator Skt .300/.600)
Cantidad y precio
Cantidad: 31
Precio unitario: $14.18194
Embalaje: Bulk
Multiplicador mínimo: 31
Embalaje: Bulk
Multiplicador mínimo: 31
Alternativas
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