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GermanySMD291SNL250T3
Resumen del número de pieza
Número de pieza del fabricante
SMD291SNL250T3
Explicación
SOLDER PASTE SAC305 250G T3
Descripción detallada
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Fabricación
Chip Quik Inc.
Plazo de entrega estándar
10 Weeks
Modelo edacad
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
allaboutcomponents.com Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight
0.551 lb (249.93 g)
Base Product Number
SMD291
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8311.30.6000
Otros nombres
-
Categoría
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291SNL250T3
Documentos y medios de comunicación
Datasheets
1(SMD291SNL250T3)
MSDS Material Safety Datasheet
1(SMD291SN)
HTML Datasheet
1(SMD291SNL250T3)
Cantidad y precio
Cantidad: 1
Precio unitario: $54.95
Embalaje: Jar
Multiplicador mínimo: 1
Embalaje: Jar
Multiplicador mínimo: 1
Alternativas
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