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Resumen del número de pieza
Número de pieza del fabricante
16-8325-311C
Explicación
CONN IC DIP SOCKET 16POS GOLD
Descripción detallada
16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Fabricación
Aries Electronics
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Aries Electronics
Series
8
Package
Bulk
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
16 (2 x 8)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame, Elevated
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.140" (3.56mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
16-8325
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
-
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 16-8325-311C
Documentos y medios de comunicación
Datasheets
1(8 Series Elevator Skt .300/.600)
Environmental Information
()
HTML Datasheet
1(8 Series Elevator Skt .300/.600)
Cantidad y precio
-
Alternativas
-