English
China
Rusia
Italy
Germany808-AG12D
Resumen del número de pieza
Número de pieza del fabricante
808-AG12D
Explicación
CONN IC DIP SOCKET 8POS TIN-LEAD
Descripción detallada
8 (2 x 4) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
Fabricación
TE Connectivity AMP Connectors
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
9,600
Inventario de proveedores
Atributos del producto
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin-Lead
Contact Finish Thickness - Mating
-
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
-
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
808
Clasificaciones medioambientales y de exportación
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
-808-AG12D-SI
A109231
1-1437537-2
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 808-AG12D
Documentos y medios de comunicación
PCN Obsolescence/ EOL
1(808-AG12D 19/Oct/2014)
Product Drawings
1(800 Series Drawing)
Cantidad y precio
-
Alternativas
-