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Resumen del número de pieza
Número de pieza del fabricante
256-PG16001-10H
Explicación
CONN SOCKET PGA GOLD
Descripción detallada
Pos PGA Socket Gold Through Hole
Fabricación
Aries Electronics
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Aries Electronics
Series
PG
Package
Bulk
Product Status
Active
Type
PGA
Number of Positions or Pins (Grid)
-
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.165" (4.19mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
256-PG1
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
-
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 256-PG16001-10H
Documentos y medios de comunicación
Datasheets
1(Pin Grid Array Socket/Header)
Environmental Information
()
HTML Datasheet
1(Pin Grid Array Socket/Header)
Cantidad y precio
-
Alternativas
-