Resumen del número de pieza

Número de pieza del fabricante
506-AG11D
Explicación
CONN IC DIP SOCKET 6POS GOLD
Descripción detallada
6 (2 x 3) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Fabricación
TE Connectivity AMP Connectors
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
1,600
Inventario de proveedores

Atributos del producto

Mfr
TE Connectivity AMP Connectors
Series
500
Package
Tube
Product Status
Obsolete
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
6 (2 x 3)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
-
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
506

Clasificaciones medioambientales y de exportación

RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040

Otros nombres

-506-AG11D-SI
A108178
6-1437529-8

Categoría

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 506-AG11D

Documentos y medios de comunicación

Datasheets
1(500 Series)
PCN Obsolescence/ EOL
1(Mult Devs 12/Jul/2021)

Cantidad y precio

-

Alternativas

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