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GermanyIC-628-SGG
Resumen del número de pieza
Número de pieza del fabricante
IC-628-SGG
Explicación
CONN IC DIP SOCKET 28POS GOLD
Descripción detallada
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Fabricación
Samtec Inc.
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Samtec Inc.
Series
IC
Package
Bulk
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyester, Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
10mOhm
Base Product Number
IC-628
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Otros nombres
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Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Samtec Inc. IC-628-SGG
Documentos y medios de comunicación
Datasheets
1(IC Series)
HTML Datasheet
()
Product Drawings
()
Cantidad y precio
-
Alternativas
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