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Resumen del número de pieza
Número de pieza del fabricante
180-PGM18006-10
Explicación
PIN GRID ARRAY SOCKET 180PIN
Descripción detallada
Pos PGA Socket Gold Through Hole
Fabricación
Aries Electronics
Plazo de entrega estándar
6 Weeks
Modelo edacad
Embalaje estándar
1
Inventario de proveedores
Atributos del producto
Mfr
Aries Electronics
Series
PGM
Package
-
Product Status
Active
Type
PGA
Number of Positions or Pins (Grid)
-
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
-
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
180-PGM
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
Q1903391A
180-PGM-180006-01
180-PGM-180006-01-ND
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 180-PGM18006-10
Documentos y medios de comunicación
Environmental Information
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Cantidad y precio
Cantidad: 21
Precio unitario: $20.28905
Embalaje: -
Multiplicador mínimo: 21
Embalaje: -
Multiplicador mínimo: 21
Alternativas
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