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Resumen del número de pieza
Número de pieza del fabricante
14-8870-10
Explicación
CONN IC DIP SOCKET 14POS TIN
Descripción detallada
14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
Fabricación
Aries Electronics
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Aries Electronics
Series
8
Package
Bulk
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
14 (2 x 7)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Material - Mating
Phosphor Bronze
Mounting Type
Through Hole
Features
Closed Frame, Elevated
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Phosphor Bronze
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.140" (3.56mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
14-8870
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
-
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 14-8870-10
Documentos y medios de comunicación
Datasheets
1(8 Series Elevator Socket)
Environmental Information
()
HTML Datasheet
1(8 Series Elevator Socket)
Cantidad y precio
-
Alternativas
-