Resumen del número de pieza

Número de pieza del fabricante
28-3570-16
Explicación
CONN IC DIP SOCKET ZIF 28POS
Descripción detallada
28 (2 x 14) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Nickel Boron Through Hole
Fabricación
Aries Electronics
Plazo de entrega estándar
5 Weeks
Modelo edacad
Embalaje estándar
Inventario de proveedores

Atributos del producto

Mfr
Aries Electronics
Series
57
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Nickel Boron
Contact Finish Thickness - Mating
50.0µin (1.27µm)
Contact Material - Mating
Beryllium Nickel
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Nickel Boron
Contact Finish Thickness - Post
50.0µin (1.27µm)
Contact Material - Post
Beryllium Nickel
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
28-3570

Clasificaciones medioambientales y de exportación

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Otros nombres

-

Categoría

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 28-3570-16

Documentos y medios de comunicación

Datasheets
1(57 Series)
Environmental Information
()
HTML Datasheet
1(57 Series)

Cantidad y precio

Cantidad: 20
Precio unitario: $37.371
Embalaje: Bulk
Multiplicador mínimo: 20

Alternativas

-