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Resumen del número de pieza
Número de pieza del fabricante
528-AG11D-ESL
Explicación
CONN IC DIP SOCKET 28POS GOLD
Descripción detallada
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Fabricación
TE Connectivity AMP Connectors
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
425
Inventario de proveedores
Atributos del producto
Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
5.00µin (0.127µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
5.00µin (0.127µm)
Contact Material - Post
Brass, Copper
Housing Material
Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
528
Clasificaciones medioambientales y de exportación
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Affected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
-
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 528-AG11D-ESL
Documentos y medios de comunicación
Datasheets
1(500 Series)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
Cantidad y precio
-
Alternativas
-