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GermanyESQ-113-44-T-D-003
Resumen del número de pieza
Número de pieza del fabricante
ESQ-113-44-T-D-003
Explicación
CONN SOCKET 26POS 0.1 TIN PCB
Descripción detallada
26 Position Elevated Socket Connector 0.100" (2.54mm) Through Hole Tin
Fabricación
Samtec Inc.
Plazo de entrega estándar
Modelo edacad
ESQ-113-44-T-D-003 Models
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Samtec Inc.
Series
ESQ
Package
Bulk
Product Status
Active
Connector Type
Elevated Socket
Contact Type
Forked
Style
Board to Board
Number of Positions
26
Number of Positions Loaded
25
Pitch - Mating
0.100" (2.54mm)
Number of Rows
2
Row Spacing - Mating
0.100" (2.54mm)
Mounting Type
Through Hole
Termination
Solder
Fastening Type
Push-Pull
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Insulation Color
Black
Insulation Height
0.735" (18.67mm)
Contact Length - Post
0.180" (4.57mm)
Operating Temperature
-55°C ~ 105°C
Material Flammability Rating
UL94 V-0
Contact Finish - Post
Tin
Mated Stacking Heights
-
Ingress Protection
-
Features
-
Current Rating (Amps)
5.7A per Contact
Voltage Rating
550VAC
Applications
-
Insulation Material
Liquid Crystal Polymer (LCP)
Contact Shape
Square
Contact Material
Phosphor Bronze
Contact Finish Thickness - Post
-
Base Product Number
ESQ-113
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Otros nombres
-
Categoría
/Product Index/Connectors, Interconnects/Rectangular Connectors/Headers, Receptacles, Female Sockets/Samtec Inc. ESQ-113-44-T-D-003
Documentos y medios de comunicación
Datasheets
1(ESQ, ESW Series Datasheet)
CAD Models
1(ESQ-113-44-T-D-003 Models)
HTML Datasheet
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Product Drawings
1(ESQ Series Drawing)
Cantidad y precio
-
Alternativas
-