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Resumen del número de pieza
Número de pieza del fabricante
515-93-089-13-082002
Explicación
SKT PGA SOLDRTL
Descripción detallada
89 (13 x 13) Pos PGA Socket Gold Through Hole
Fabricación
Mill-Max Manufacturing Corp.
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
Inventario de proveedores
Atributos del producto
Mfr
Mill-Max Manufacturing Corp.
Series
515
Package
Bulk
Product Status
Active
Type
PGA
Number of Positions or Pins (Grid)
89 (13 x 13)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass Alloy
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.108" (2.74mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
10mOhm
Base Product Number
515-93
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
-
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Mill-Max Manufacturing Corp. 515-93-089-13-082002
Documentos y medios de comunicación
Datasheets
()
Environmental Information
1(RoHS Cert)
Cantidad y precio
-
Alternativas
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