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Resumen del número de pieza
Número de pieza del fabricante
28-6574-11
Explicación
CONN IC DIP SOCKET ZIF 28POS TIN
Descripción detallada
28 (2 x 14) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
Fabricación
Aries Electronics
Plazo de entrega estándar
5 Weeks
Modelo edacad
Embalaje estándar
11
Inventario de proveedores
Atributos del producto
Mfr
Aries Electronics
Series
57
Package
Bulk
Product Status
Active
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
200.0µin (5.08µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature
-
Termination Post Length
0.110" (2.78mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
-
Base Product Number
28-6574
Clasificaciones medioambientales y de exportación
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Otros nombres
28657411
A442-NDR
A442
Categoría
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 28-6574-11
Documentos y medios de comunicación
Datasheets
1(57 Series)
Environmental Information
()
HTML Datasheet
1(57 Series)
Product Drawings
1(6574 Series)
Cantidad y precio
Cantidad: 22
Precio unitario: $22.07227
Embalaje: Bulk
Multiplicador mínimo: 22
Embalaje: Bulk
Multiplicador mínimo: 22
Alternativas
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