Resumen del número de pieza

Número de pieza del fabricante
528-AG12D-LF
Explicación
CONN IC DIP SOCKET 28POS TIN
Descripción detallada
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
Fabricación
TE Connectivity AMP Connectors
Plazo de entrega estándar
Modelo edacad
Embalaje estándar
425
Inventario de proveedores

Atributos del producto

Mfr
TE Connectivity AMP Connectors
Series
500
Package
Bulk
Product Status
Obsolete
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Tin
Contact Finish Thickness - Mating
-
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
-
Contact Material - Post
Beryllium Copper
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
528

Clasificaciones medioambientales y de exportación

RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040

Otros nombres

1571550-9
1571550-9-ND

Categoría

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 528-AG12D-LF

Documentos y medios de comunicación

Datasheets
1(1571550)
Environmental Information
1(1571550-9 Statement of Compliance)
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(1571550)
3D Drawings
1(1571550-9.pdf)

Cantidad y precio

-

Alternativas

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