Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
HF115AC-0.0055-AC-105
BESCHREIBUNG
THERM PAD 36.83X21.29MM W/ADH
DETAILIERTE BESCHREIBUNG
Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side
HERSTELLER
Bergquist
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
100

Technische Daten

Mfr
Bergquist
Series
Hi-Flow® 115-AC
Package
Bulk
Product Status
Active
Usage
SIP
Type
Pad, Sheet
Shape
Rectangular
Outline
36.83mm x 21.29mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
HF115AC

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8546.90.0000

Andere Namen

HF115AC-105
BER170
HF115TAAC-105
HF115AC00055AC105

Kategorie

/Product Index/Fans, Thermal Management/Thermal/Pads, Sheets/Bergquist HF115AC-0.0055-AC-105

Dokumente und Medien

Datasheets
()
Other Related Documents
()
PCN Packaging
1(Henkel/Berquist Revised Brands 10/May/2016)
PCN Manufacturer Information
1(Multiple Devices Manufacture Information 25/Oct/2019)
Product Drawings
1(SIP_105)
Forum Discussions
1(Bergquist Thermal Pad, Sheets Outline Configuration Suffix’s)

Menge Preis

-

Stellvertreter

Teil Nr. : A10832-02
Hersteller. : Laird Technologies - Thermal Materials
Verfügbare Menge. : 12
Einzelpreis. : $46.05000
Ersatztyp. : Similar