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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
0C97055902
BESCHREIBUNG
RFI EMI GROUNDING MATERIAL 25FT
DETAILIERTE BESCHREIBUNG
HERSTELLER
Laird Technologies EMI
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
25
Lagerbestände
Technische Daten
Mfr
Laird Technologies EMI
Series
Twist
Package
Bulk
Product Status
Active
Type
Fingerstock
Shape
-
Width
0.300" (7.62mm)
Length
24.000" (609.60mm)
Height
0.070" (1.78mm)
Material
Beryllium Copper
Plating
Unplated
Plating - Thickness
-
Attachment Method
Adhesive
Operating Temperature
121°C
Shelf Life Start
-
Shelf Life
-
Storage/Refrigeration Temperature
-
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
4016.93.1050
Andere Namen
-
Kategorie
/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 0C97055902
Dokumente und Medien
Datasheets
1(Low Profile Gasket Catalog)
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
HTML Datasheet
1(Low Profile Gasket Catalog)
Menge Preis
-
Stellvertreter
-