Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
SEAMP-50-02.0-S-06
BESCHREIBUNG
CONN HD ARRAY M 300POS PRESS-FIT
DETAILIERTE BESCHREIBUNG
300 Position Connector High Density Array, Male Through Hole Gold
HERSTELLER
Samtec Inc.
STANDARD LEADTIME
5 Weeks
EDACAD-MODELL
SEAMP-50-02.0-S-06 Models
STANDARDPAKET
33

Technische Daten

Mfr
Samtec Inc.
Series
SEARAY™ SEAMP
Package
Tray
Product Status
Active
Connector Type
High Density Array, Male
Number of Positions
300
Pitch
0.050" (1.27mm)
Number of Rows
6
Mounting Type
Through Hole
Features
-
Contact Finish
Gold
Contact Finish Thickness
30.0µin (0.76µm)
Mated Stacking Heights
7mm, 8mm, 8.5mm
Height Above Board
0.181" (4.60mm)
Base Product Number
SEAMP-50

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

-

Kategorie

/Product Index/Connectors, Interconnects/Rectangular Connectors/Arrays, Edge Type, Mezzanine (Board to Board)/Samtec Inc. SEAMP-50-02.0-S-06

Dokumente und Medien

Datasheets
1(SEAMP Series Datasheet)
Featured Product
1(EV Charging Solutions)
CAD Models
1(SEAMP-50-02.0-S-06 Models)

Menge Preis

QUANTITÄT: 33
Einzelpreis: $28.14758
Verpackung: Tray
MinMultiplikator: 33

Stellvertreter

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