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China824-AG66D
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
824-AG66D
BESCHREIBUNG
CONN IC DIP SOCKET 24POS GOLD
DETAILIERTE BESCHREIBUNG
24 (2 x 12) Pos DIP, 0.4" (10.16mm) Row Spacing Socket Gold Through Hole
HERSTELLER
TE Connectivity AMP Connectors
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1,632
Lagerbestände
Technische Daten
Mfr
TE Connectivity AMP Connectors
Series
800
Package
Bulk
Product Status
Active
Type
DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)
24 (2 x 12)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
25.0µin (0.63µm)
Contact Material - Mating
Copper Alloy
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
80.0µin (2.03µm)
Contact Material - Post
Copper Alloy
Housing Material
Polyester
Operating Temperature
-55°C ~ 105°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
10mOhm
Base Product Number
824
Umweltverträgliche Exportklassifikationen
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/TE Connectivity AMP Connectors 824-AG66D
Dokumente und Medien
Product Drawings
1(1437539-2 Drawing)
Menge Preis
-
Stellvertreter
-