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Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
342950
BESCHREIBUNG
COPPER HEATSINK 90X90X10MM
DETAILIERTE BESCHREIBUNG
Heat Sink BGA Copper Top Mount, Skived
HERSTELLER
Boyd Laconia, LLC
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
50
Lagerbestände
Technische Daten
Mfr
Boyd Laconia, LLC
Series
-
Package
Tray
Product Status
Active
Type
Top Mount, Skived
Package Cooled
BGA
Attachment Method
Push Pin
Shape
Square, Fins
Length
3.543" (90.00mm)
Width
3.543" (90.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
1.30°C/W @ 200 LFM
Thermal Resistance @ Natural
4.50°C/W
Material
Copper
Material Finish
AavSHIELD 3C
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
8473.30.5100
Andere Namen
HS486
342950-ND
Kategorie
/Product Index/Fans, Thermal Management/Thermal/Heat Sinks/Boyd Laconia, LLC 342950
Dokumente und Medien
Datasheets
1(342940-50 Datasheet)
Other Related Documents
1(Heat Sink Fabrications Guide)
Featured Product
1(Copper Skived-Fin Heat Sinks)
HTML Datasheet
1(342940-50 Datasheet)
Menge Preis
QUANTITÄT: 100
Einzelpreis: $54.7915
Verpackung: Tray
MinMultiplikator: 100
Verpackung: Tray
MinMultiplikator: 100
Stellvertreter
-