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ChinaMC33PF8200DBESR2
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
MC33PF8200DBESR2
BESCHREIBUNG
POWER MANAGEMENT IC I.MX8 PRE-PR
DETAILIERTE BESCHREIBUNG
High Performance i.MX 8, S32x Processor Based PMIC 56-HVQFN (8x8)
HERSTELLER
NXP USA Inc.
STANDARD LEADTIME
26 Weeks
EDACAD-MODELL
STANDARDPAKET
4,000
Lagerbestände
Technische Daten
Mfr
NXP USA Inc.
Series
-
Package
Tape & Reel (TR)
Product Status
Active
Applications
High Performance i.MX 8, S32x Processor Based
Current - Supply
-
Voltage - Supply
2.5V ~ 5.5V
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount, Wettable Flank
Package / Case
56-VFQFN Exposed Pad
Supplier Device Package
56-HVQFN (8x8)
Base Product Number
MC33PF8200
Umweltverträgliche Exportklassifikationen
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Andere Namen
935382424528
568-MC33PF8200DBESR2TR
Kategorie
/Product Index/Integrated Circuits (ICs)/Power Management (PMIC)/Power Management - Specialized/NXP USA Inc. MC33PF8200DBESR2
Dokumente und Medien
Datasheets
1(PF8100, PF8200)
Environmental Information
()
PCN Design/Specification
1(Mult Dev DS Update 26/Feb/2021)
PCN Assembly/Origin
1(Mult Dev A/T Site 28/Apr/2021)
PCN Packaging
()
Menge Preis
QUANTITÄT: 4000
Einzelpreis: $7.45933
Verpackung: Tape & Reel (TR)
MinMultiplikator: 4000
Verpackung: Tape & Reel (TR)
MinMultiplikator: 4000
Stellvertreter
-