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WB3F200VD1T
Übersicht der Teilenummer
TEILNUMMER DES HERSTELLERS
WB3F200VD1T
BESCHREIBUNG
CONN RCPT 200POS SMD GOLD
DETAILIERTE BESCHREIBUNG
200 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold
HERSTELLER
JAE Electronics
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
1,000
Lagerbestände
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Technische Daten
Mfr
JAE Electronics
Series
WB3
Package
Tray
Product Status
Obsolete
Connector Type
Receptacle, Center Strip Contacts
Number of Positions
200
Pitch
0.020" (0.50mm)
Number of Rows
2
Mounting Type
Surface Mount
Features
Board Guide, Solder Retention
Contact Finish
Gold
Contact Finish Thickness
30.0µin (0.76µm)
Mated Stacking Heights
4mm, 5mm
Height Above Board
0.126" (3.20mm)
Base Product Number
WB3F200
Umweltverträgliche Exportklassifikationen
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8536.69.4040
Andere Namen
-
Kategorie
/Product Index/Connectors, Interconnects/Rectangular Connectors/Arrays, Edge Type, Mezzanine (Board to Board)/JAE Electronics WB3F200VD1T
Dokumente und Medien
Datasheets
1(Board-to-Board Selection Guide)
PCN Obsolescence/ EOL
1(Multiple Devices 17/Apr/2015)
HTML Datasheet
1(Board-to-Board Selection Guide)
Product Drawings
1(WB3 Series Receptacle)
Menge Preis
-
Stellvertreter
-
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