Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
114-93-320-41-117000
BESCHREIBUNG
CONN IC DIP SOCKET 20POS GOLD
DETAILIERTE BESCHREIBUNG
20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount
HERSTELLER
Mill-Max Manufacturing Corp.
STANDARD LEADTIME
2 Weeks
EDACAD-MODELL
STANDARDPAKET
20

Technische Daten

Mfr
Mill-Max Manufacturing Corp.
Series
114
Package
Tube
Product Status
Active
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
20 (2 x 10)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin-Lead
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass Alloy
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
-
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
114-93

Umweltverträgliche Exportklassifikationen

RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

11493-32041117000
1149332041117000

Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Mill-Max Manufacturing Corp. 114-93-320-41-117000

Dokumente und Medien

Datasheets
()

Menge Preis

QUANTITÄT: 60
Einzelpreis: $13.61583
Verpackung: Tube
MinMultiplikator: 60

Stellvertreter

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