Übersicht der Teilenummer

TEILNUMMER DES HERSTELLERS
BU280Z-178-HT
BESCHREIBUNG
CONN IC DIP SOCKET 28POS GOLD
DETAILIERTE BESCHREIBUNG
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Surface Mount
HERSTELLER
On Shore Technology Inc.
STANDARD LEADTIME
EDACAD-MODELL
STANDARDPAKET
14

Technische Daten

Mfr
On Shore Technology Inc.
Series
BU-178HT
Package
Tube
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
78.7µin (2.00µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Copper
Contact Finish Thickness - Post
Flash
Contact Material - Post
Brass
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature
-55°C ~ 125°C
Termination Post Length
0.059" (1.50mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
1 A
Contact Resistance
7mOhm
Base Product Number
BU280Z

Umweltverträgliche Exportklassifikationen

RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040

Andere Namen

BU280Z178HT
ED2209-NDR
ED2209

Kategorie

/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/On Shore Technology Inc. BU280Z-178-HT

Dokumente und Medien

Datasheets
1(BUxx0Z-178HT Datasheet)
Environmental Information
1(OnShore RoHS/REACH)
HTML Datasheet
()
Product Drawings
1(BU-xx0Z-178HT Drawing)

Menge Preis

QUANTITÄT: 56
Einzelpreis: $2.89375
Verpackung: Tube
MinMultiplikator: 56

Stellvertreter

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